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DLA - DSCC-VID-V62/09626

MICROCIRCUIT, DIGITAL-LINEAR, 16 CHANNEL, 24 BIT ANALOG TO DIGITAL CONVERTER, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 12 May 2009
Status: inactive
Page Count: 17
scope:

This drawing documents the general requirements of a high performance 16 channel, 24 bit analog to digital converter (ADC) microcircuit, with an operating temperature range of -55ºC to +125ºC.

Document History

DSCC-VID-V62/09626 REV C
January 13, 2022
MICROCIRCUIT, DIGITAL-LINEAR, 16 CHANNEL, 24 BIT ANALOG TO DIGITAL CONVERTER, MONOLITHIC SILICON
Scope. This drawing documents the general requirements of a high performance16 channel, 24 bit analog to digital converter (ADC) microcircuit, with an operating temperature range of -55°C to +125°C...
DSCC-VID-V62/09626 REV B
July 7, 2016
MICROCIRCUIT, DIGITAL-LINEAR, 16 CHANNEL, 24 BIT ANALOG TO DIGITAL CONVERTER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance 16 channel, 24 bit analog to digital converter (ADC) microcircuit, with an operating temperature range of -55°C to +125°C for...
DSCC-VID-V62/09626 REV A
January 7, 2010
MICROCIRCUIT, DIGITAL-LINEAR, 16 CHANNEL, 24 BIT ANALOG TO DIGITAL CONVERTER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance 16 channel, 24 bit analog to digital converter (ADC) microcircuit, with an operating temperature range of -55°C to +125°C for...
DSCC-VID-V62/09626
May 12, 2009
MICROCIRCUIT, DIGITAL-LINEAR, 16 CHANNEL, 24 BIT ANALOG TO DIGITAL CONVERTER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance 16 channel, 24 bit analog to digital converter (ADC) microcircuit, with an operating temperature range of -55ºC to +125ºC.

References

This document references:
JEP95 BOOK 1 - Book One Registered and Standard Outlines for Solid State and Related Products
Published by JEDEC on March 1, 1997
PREFACE This Publication contains those solid state product outlines and other associated drawings that have been registered and assigned a JEDEC designation and are printed on white paper. Product...
This document references:
JEDEC JESD 51-3 - Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on August 1, 1996
This standard describes design requirements for a single layer, leaded surface mount integrated circuit package thermal test board. The standard describes board material and geometry requirements,...
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
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