IPC - TM-650 2.6.27
Thermal Stress, Convection Reflow Assembly Simulation
| Organization: | IPC |
| Publication Date: | 1 May 2009 |
| Status: | inactive |
| Page Count: | 8 |
scope:
This method shall be used to simulate exposure to the thermal conditions of convection reflow assembly.
Purpose This method shall be used to replicate the thermodynamic effects of assembly on the test specimen. The use of this method in accordance with the requirements defined herein shall cover those effects that are the result of convection reflow assembly, rework or repair.
This method shall be used for qualification testing of an applicable test specimen. The evaluation of acceptability for qualification shall be in accordance with the requirements defined in 5.3.
This method may be used for lot acceptance.The evaluation for lot acceptability should be in accordance with the requirements defined in 5.3 or as agreed upon between user and supplier (AABUS).
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