scope:

This specification establishes the general requirements for semiconductor devices. Detail requirements and characteristics are specified in the detail specification. Four levels of product assurance requirements for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS (see table Ia). Seven radiation hardness assurance (RHA) levels are provided for JANTXV and JANS product assurance levels (see table Ib). These are designated by the letters M, D, L, R, F, G, and H following the product assurance identifier portion of the prefix. Two levels of product assurance requirements for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC. A parts per million (PPM) quality system is used for documenting and reporting the average outgoing quality of discrete semiconductor devices supplied to this specification, except for devices which are inactive for new design. Statistical process control (SPC) techniques are required in the manufacturing process to minimize variation in production of discrete semiconductor devices supplied to the requirements of this specification.

The identification for semiconductor devices furnished under this specification shall be formulated as follows: *Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Electronics Supply Center, ATTN: DESC-ELDT, 1507 Wilmington Pike, Dayton, OH 45444-5765, using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

The following prefixes shall be used as applicable (see tables Ia and Ib).

The levels of product assurance (listed above) for encapsulated devices from the lowest level to the highest level shall be JAN, JANTX, JANTXV, and JANS. A higher assurance level product is substitutable for a lower assurance level product.

A device of a higher product assurance level may be substitute for the same basic part number device of a lower product assurance level. Product assurance levels, in descending order of assurance are: JANS, JANTXV, JANTX, and JAN. RHA devices tested to a higher total dose requirement may be substituted for the same basic part number device with a lower total dose requirement (see table Ib). For axial leaded diodes, where the same part number both with, and without a dash one (-1) suffix, the dash one device is considered to be a higher assurance level and may be substituted for the non-dash one part. For those devices selected to voltage tolerances (e.g., zener diodes, transient voltage suppressors) the tighter tolerance device may be substituted for one of more relaxed tolerance. Nondash one devices are inactive for new design (whenever dash-one devices exist) and dash-one devices shall be used in lieu of nondash-one devices. JANTX'P' devices are substitutable for JANTX devices and JANTXV'P' devices are substitutable for JANTXV devices. Devices having suffix letters L or S or no lead length designator, may be substituted for each other in applications where the alternate lead length will fit.

Two levels of unencapsulated devices designated JANHC and JANKC are available. The requirements and quality conformance inspection (QCI) are as specified in appendix H. Information on a specific device will be as specified in the associated detail specification for that device.

Semiconductor devices are identified by the prefix "XN". An "X" will usually be a number that is one less than the number of active element terminations.

It is recommended that each type of semiconductor device intended for standardization be assigned an identification, serially, by the Joint Electron Device Engineering Council, a council sponsored by the Electronic Industries Association (EIA) and the National Electrical Manufacturers Association. The assignment will provide the component designation the identification number.

The following suffix letters may be incorporated in the military type number as applicable.

A, B, C, etc.- - - - - - - - - Indicates a modified version which is substitutable for the basic (except L, M, P, R, S, U) numbered (nonsuffix) device. M - - - - - - - - - - - - - - Indicates matching of specified parameters of separate devices. R - - - - - - - - - - - - - - Indicates reverse polarity packaging of the basic numbered device. L or S - - - - - - - - - - - - Indicates that the terminal leads are longer or shorter, respectively, than those of the basic numbered device. U - - - - - - - - - - - - - - Indicates unleaded or surface mounted devices. P - - - - - - - - - - - - - - Indicates particle impact noise detection (PIND) screened devices (for JANTX and JANTXV only). UR - - - - - - - - - - - - - - Indicates unleaded or surface mounted (round end cap diodes). US - - - - - - - - - - - - - - Indicates unleaded or surface mounted (square end cap diodes).

Suffix letter(s) except for P suffix, shall be used and marked on the device only when specific device types are covered by the applicable associated detail specification requiring the suffix letters (see 3.7.3 and 3.7.6.1).