scope:

This specification establishes the general performance requirements for semiconductor devices. Detail requirements and characteristics are specified in the associated specification. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Seven radiation hardness assurance (RHA) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

This specification contains the performance requirement and verification methods for semiconductor devices. The main body specifies the performance requirements and requires the manufacturer to verify that their devices are capable of meeting those performance requirements. Appendix A contains definitions of terms used throughout the specification. Appendix B contains abbreviations and symbols. Appendix C contains the statistical sampling and life test procedures. Appendix D contains the quality system requirements. Appendix E contains the standard verification flow for encapsulated devices. Appendix F contains the certification requirements for Radiation Hardness Assured semiconductor devices. Appendix G contains the standard verification flow for unencapsulated devices. Appendix H contains critical interface and materials for semiconductor devices.

The part numbering schemes are as follows:

a. The Part or Identifying Number (PIN) for encapsulated semiconductor devices furnished under this specification is formulated as follows: Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Defense Electronics Supply Center, ATTN: DESC-ELD, 1507 Wilmington Pike, Dayton, OH 45444-5765, by using the Standardization Document: Improvement Proposal (DD form 1426) appearing at the end of this document or by letter.

b. The PIN for unencapsulated semiconductor devices furnished under this specification is formulated as follows:

The quality levels for encapsulated devices includes the JAN brand and associated modifiers as applicable (denoted by "QQQ" in 1.3). These quality levels from the lowest level to the highest level are JAN, JANTX, JANTXV, and JANS. JANS is intended for space applications.

The quality levels for unencapsulated devices includes the JAN brand and associated modifiers as applicable (denoted by "QC" in 1.3). JANKC is intended for space applications and JANHC is intended for standard military applications.

The RHA designator is a letter which identifies the applicable RHA level as defined in appendix F (denoted by "A" in 1.3). The RHA levels from lowest to highest are M, D, L, R, F, G, and H.

Semiconductor devices are identified by the prefix "XN". The "X" will usually be a number that is one less than the number of active element terminations.

It is recommended that each type of semiconductor device intended for standardization be assigned an identification, serially, by the Joint Electron Device Engineering Council, a council sponsored by the Electronic Industries Association (EIA) and the National Electrical Manufacturers Association. The assignment will provide the component designation and the identification number.

The following suffix letters may be incorporated in the military type number as applicable.

A, B, C, etc - - - - - - - - - Indicates a modified version which is substitutable for the basic (except L, M, R, S, U) numbered (nonsuffix) device. M - - - - - - - - - - - - - - Indicates matching of specified parameters of separate devices. R - - - - - - - - - - - - - - Indicates reverse polarity packaging of the basic numbered device. L or S - - - - - - - - - - - - Indicates that the terminal leads are longer or shorter, respectively, than those of the basic numbered device. U - - - - - - - - - - - - - - Indicates unleaded or surface mounted devices. UR - - - - - - - - - - - - - - Indicates unleaded or surface mounted (round end cap diodes). US - - - - - - - - - - - - - - Indicates unleaded or surface mounted (square end cap diodes). −1 - - - - - - - - - - - - - - Indicates metallurgical bond.

Suffix letter(s) are used and marked on the device only when specific device types are covered by the applicable associated specification requiring the suffix letters (see 3.10.6).