UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

JEDEC JESD 91

Method for Developing Acceleration Models for Electronic Component Failure Mechanisms

active, Most Current
Buy Now
Organization: JEDEC
Publication Date: 1 August 2003
Status: active
Page Count: 20
scope:

The method described in this document applies to all reliability mechanisms associated with electronic components.

The purpose of this standard is to provide a reference for developing acceleration models for defect-related and wear-out mechanisms in electronic components.

Document History

JESD91B
March 1, 2022
Method for Developing Acceleration Models for Electronic Device Failure Mechanisms
The method described in this document applies to all reliability mechanisms associated with electronic devices. The purpose of this standard is to provide a reference for developing acceleration...
JEDEC JESD 91
August 1, 2003
Method for Developing Acceleration Models for Electronic Component Failure Mechanisms
The method described in this document applies to all reliability mechanisms associated with electronic components. The purpose of this standard is to provide a reference for developing acceleration...
JESD91A
August 1, 2003
Method for Developing Acceleration Models for Electronic Component Failure Mechanisms
The method described in this document applies to all reliability mechanisms associated with electronic components.The purpose of this standard is to provide a reference for developing acceleration...
JEDEC JESD 91
December 1, 2001
Method for Developing Acceleration Models for Electronic Component Failure Mechanisms
A description is not available for this item.

References

This document references:
JEDEC JESD 47 - Stress-Test-Driven Qualification of Integrated Circuits
Published by JEDEC on August 1, 2018
This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. These...
This document references:
JEDEC JESD 74 - Early Life Failure Rate Calculation Procedure for Semiconductor Components
Published by JEDEC on February 1, 2007
This standard defines methods for calculating the early life failure rate of a product, using accelerated testing, whose failure rate is constant or decreasing over time. For technologies where there...
This document references:
JESD85A - Methods for Calculating Failure Rates in Units of FITs
Published by JEDEC on July 1, 2021
The methods described in this document apply to failure modes and mechanisms whose failures exhibit a constant failure rate, e.g., an Arrhenius behavior characterized by an activation energy for...
This document references:
JEDEC JESD 47 - Stress-Test-Driven Qualification of Integrated Circuits
Published by JEDEC on August 1, 2018
This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. These...
This document is referenced by:
IEC 62239-1 - Process management for avionics – Management plan – Part 1: Preparation and maintenance of an electronic components management plan
Published by IEC on September 1, 2018
This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the...
This document is referenced by:
JEDEC JEP 150 - Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State Surface-Mount Components
Published by JEDEC on June 1, 2013
This publication contains a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as...
This document is referenced by:
JEDEC JESD 88 - JEDEC Dictionary of Terms for Solid State Technology
Published by JEDEC on July 1, 2007
Each term and definition in this dictionary has been included strictly for application within the solid-state industry. Many of the terms and definitions in this dictionary may have applicability...
This document is referenced by:
JEDEC JESD 237 - Reliability Qualification of Power Amplifier Modules
Published by JEDEC on March 1, 2014
This standard describes a baseline set of acceptance tests for use in qualifying power amplifier modules as an individual new product, a product family, or as products in a process which is being...
This document is referenced by:
JEDEC JEP 001 - FOUNDRY PROCESS QUALIFICATION GUIDELINES – FRONT END TRANSISTOR LEVEL (Wafer Fabrication Manufacturing Sites)
Published by JEDEC on September 1, 2018
This document describes transistor-level test and data methods for the qualification of semiconductor technologies. It does not give pass or fail values or recommend specific test equipment, test...
View Less
View All
Advertisement