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JEDEC - JESD91B

Method for Developing Acceleration Models for Electronic Device Failure Mechanisms

active, Most Current
Organization: JEDEC
Publication Date: 1 March 2022
Status: active
Page Count: 20
scope:

The method described in this document applies to all reliability mechanisms associated with electronic devices.

The purpose of this standard is to provide a reference for developing acceleration models for defect-related and wear-out mechanisms in electronic devices.

Document History

JESD91B
March 1, 2022
Method for Developing Acceleration Models for Electronic Device Failure Mechanisms
The method described in this document applies to all reliability mechanisms associated with electronic devices. The purpose of this standard is to provide a reference for developing acceleration...
JEDEC JESD 91
August 1, 2003
Method for Developing Acceleration Models for Electronic Component Failure Mechanisms
The method described in this document applies to all reliability mechanisms associated with electronic components. The purpose of this standard is to provide a reference for developing acceleration...
JESD91A
August 1, 2003
Method for Developing Acceleration Models for Electronic Component Failure Mechanisms
The method described in this document applies to all reliability mechanisms associated with electronic components.The purpose of this standard is to provide a reference for developing acceleration...
JEDEC JESD 91
December 1, 2001
Method for Developing Acceleration Models for Electronic Component Failure Mechanisms
A description is not available for this item.

References

This document references:
JEDEC JESD 47 - Stress-Test-Driven Qualification of Integrated Circuits
Published by JEDEC on August 1, 2018
This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. These...
This document references:
JEDEC JEP 122 - Failure Mechanisms and Models for Semiconductor Devices
Published by JEDEC on September 1, 2016
This publication provides a list of failure mechanisms and their associated activation energies or acceleration factors that may be used in making system failure rate estimations when the only...
This document references:
JEDEC JESD 47 - Stress-Test-Driven Qualification of Integrated Circuits
Published by JEDEC on August 1, 2018
This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. These...
This document references:
JEDEC JESD 74 - Early Life Failure Rate Calculation Procedure for Semiconductor Components
Published by JEDEC on February 1, 2007
This standard defines methods for calculating the early life failure rate of a product, using accelerated testing, whose failure rate is constant or decreasing over time. For technologies where there...
This document references:
JESD85A - Methods for Calculating Failure Rates in Units of FITs
Published by JEDEC on July 1, 2021
The methods described in this document apply to failure modes and mechanisms whose failures exhibit a constant failure rate, e.g., an Arrhenius behavior characterized by an activation energy for...
This document is referenced by:
BS PD IEC/TS 62564-1 - TC - Tracked Changes (Redline) - Process management for avionics — Aerospace qualified electronic components (AQEC) Part 1: Integrated circuits and discrete semiconductors
Published by BSI on February 26, 2020
A description is not available for this item.
This document is referenced by:
JEP194 - Guideline for Gate Oxide Reliability and Robustness Evaluation Procedures for Silicon Carbide Power MOSFETs
Published by JEDEC on February 1, 2023
This document has two purposes; the first is presenting guidelines for the gate dielectric lifetime extraction and wear-out of MOS devices on silicon carbide substrates ("intrinsic behavior")....
This document is referenced by:
BS PD IEC TR 62240-2 - Process management for avionics - Electronic components capability in operation Part 2: Semiconductor microcircuit lifetime
Published by BSI on July 31, 2018
A description is not available for this item.
This document is referenced by:
JEDEC JESD 93 - Hybrids/MCM
Published by JEDEC on September 1, 2005
This specification establishes the general requirements for hybrid microcircuits, RF/microwave hybrid microcircuits and MCMs (hereafter referred to as devices). Detailed performance requirements for...
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