scope:

This drawing forms a part of a one part- one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54ACT16244 16-bit bus driver with 3-state outputs, TTL compatible inputs

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 48 Flat pack

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) - - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC +0.5 V dc DC output voltage range (V_OUT) - - - - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc Input clamp current (I_IK) (V_IN < 0 V, V_IN > V_CC) - - - - - - - - ±20 mA Output clamp current (I_OK) (V_OUT < 0 V, V_OUT > V_CC) - - - - - - ±50 mA DC output current (I_OUT) (V_OUT = 0 to V_CC) (per output) - - - - ±50 mA DC V_CC or GND current (I_CC, I_GND) - - - - - - - - - - - - - - - ±400 mA Storage temperature range (T_STG) - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - +260°C Thermal resistance, junction-to-case (Θ_JC) - - - - - - - - - - - 9.9 °C/W Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - +175°C Case operating temperature (T_C) - - - - - - - - - - - - - - - - −55°C to +125°C

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - - - - +4.5 V dc +5.5 V dc Input voltage range (V_IN) - - - - - - - - - - - - - - - - - - - +0.0 V dc to V_CC Input voltage range (V_OUT) - - - - - - - - - - - - - - - - - - - +0.0 V dc to V_CC Maximum low level input voltage (V_IL) - - - - - - - - - - - - - 0.8 V Minimum high level input voltage(V_IH) - - - - - - - - - - - - - 2.0 V Case operating temperature range (T_C) - - - - - - - - - - - - - −55°C to +125°C Input rise and fall rate (t_r, t_f) maximum: (10% to 90% of V_IN, 90% to 10% of V_IN) - - - - - - - - - - - - 10 ns/V Maximum high level output current (I_OH) - - - - - - - - - - - - −24 mA Maximum low level output current (I_OL) - - - - - - - - - - - - - +24 mA

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - XX percent 6/

intended Use: