scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked device shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Data retention Access time 01 7006 16k × 8 Dual Port Static RAM No 70 ns 02 7006 16k × 8 Dual Port Static RAM Yes 70 ns 03 7006 16k × 8 Dual Port Static RAM No 55 ns 04 7006 16k × 8 Dual Port Static RAM Yes 55 ns 05 7006 16k × 8 Dual Port Static RAM No 45 ns 06 7006 16k × 8 Dual Port Static RAM Yes 45 ns

The device class designator shall be a single letter identifying the product assurance level (see 6.6 herein) as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMAG3-PN 68 pin grid array Y See figure 1 68 flat pack

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, or C are considered acceptable and interchangeable without preference.

Supply voltage (V_CC)- - - - - - - - - - - −0.5 V dc to +7.0 V dc Storage temperature range - - - - - - - - −65°C to +150°C DC output current - - - - - - - - - - - - 50 mA Maximum power dissipation (P_D)- - - - - - 2.2 W Lead temperature (soldering, 10 seconds)- 260°C Thermal resistance, junction-to-case (Θ_JC): Case X- - - - - - - - - - - - - - - - - See MIL-STD-1835 Case Y- - - - - - - - - - - - - - - - - 20°C/W Maximum junction temperature (T_J) - - - - +150°C 3/ DC input voltage range- - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc 4/ DC output voltage range - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc 4/ Output voltage applied in high Z state- - −0.5 V dc to V_CC + 0.5 V dc

Supply voltage (V_CC)- - - - - - - - - - - +4.5 V dc to +5.5 V dc High level input voltage (V_IH)- - - - - - +2.2 V dc to +6.0 V dc Low level input voltage (V_IL) 2/ - - - - −0.5 V dc to +0.8 V dc Case operating temperature range (T_C) - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - 5/ percent

intended Use: