scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Data retention Access time 01 7006 16k × 8 Dual Port Static RAM No 70ns 02 7006 16k × 8 Dual Port Static RAM Yes 70ns 03 7006 16k × 8 Dual Port Static RAM No 55ns 04 7006 16k × 8 Dual Port Static RAM Yes 55ns 05 7006 16k × 8 Dual Port Static RAM No 45ns 06 7006 16k × 8 Dual Port Static RAM Yes 45ns 07 7006 16k × 8 Dual Port Static RAM No 35ns 08 7006 16k × 8 Dual Port Static RAM Yes 35ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA3-PN 68 pin grid array Y See figure 1 68 flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)---------------- ------ −0.5 V dc to +7.0 V dc Storage temperature range----------------- ------ −65°C to +150°C DC output current---------------------- --------- 50 mA Maximum power dissipation (P_D)------------- ----- 2.2 W Lead temperature (soldering, 10 seconds)---- ---- 260°C Thermal resistance, junction-to-case (Θ_JC): Case X---------------------------- ------------- See MIL-STD-1835 Case Y---------------------------- ------------- 20°C/W Maximum junction temperature (T_J)---------- ----- +150°C 3/ DC input voltage range--------------------------- −0.5 V dc to V_CC + 0.5 V dc 4/ DC output voltage range----------------- -------- −0.5 V dc to V_CC + 0.5 V dc 4/ Output voltage applied in high Z state---- ------ −0.5 V dc to V_CC + 0.5 V dc

Supply voltage (V_CC) ---------------------------- +4.5 V dc to +5.5 V dc High level input voltage (V_IH) ------------------ +2.2 V dc to +6.0 V dc Low level input voltage (V_IL) 2/ ---------------- −0.5 V dc to +0.8 V dc Case operating temperature range (T_C) ----------- −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)------ 5/ percent

intended Use: