BSI - BS EN 60191-6-17
Mechanical standardization of semiconductor devices Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P PFLGA)
active, Most Current
Buy Now
| Organization: | BSI |
| Publication Date: | 30 June 2011 |
| Status: | active |
| Page Count: | 32 |
| ICS Code (Electrical and electronics engineering drawings): | 01.100.25 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
BS EN 60191-6-17
June 30, 2011
Mechanical standardization of semiconductor devices Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P PFLGA)
A description is not available for this item.
Related Products
Searching for related products...