This specification sheet was developed for the use of verifying the performance of printed boards of single or double sided conductor layers constructed of high frequency base materials. The high frequency laminates are either homogenous thermoplastic resin base materials (primarily polytetraflouroethylene resins) or thermosetting resin base materials. The printed boards will use soldering for component mounting and may or may not have plated-through holes or metal backing materials. Printed boards of other base material types or construction styles can be tested or verified to the performance requirements contained in this document; however, the performance parameters of other MIL−PRF−31032 performance specifications sheets may be more suited for verifying those designs.