CEI EN IEC 62878-2-5
Device embedding assembly technology Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
|Publication Date:||1 April 2020|
|ICS Code (Electronic component assemblies):||31.190|
|ICS Code (Printed circuits and boards):||31.180|
This part of IEC 62878 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
This part of IEC 62878 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.