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NEN-EN-IEC 62878-2-5

Device embedding assembly technology - Part 2- 5: Guidelines - Implementation of a 3D data format for device embedded substrate

active, Most Current
Organization: NEN
Publication Date: 1 November 2019
Status: active
Page Count: 64
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 62878 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.

This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.

This part of IEC 62878 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

Document History

NEN-EN-IEC 62878-2-5
November 1, 2019
Device embedding assembly technology - Part 2- 5: Guidelines - Implementation of a 3D data format for device embedded substrate
This part of IEC 62878 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices...

References

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