DOD - SMD 5962-13207
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, FOUR - 2MEG X 8-BIT or ONE - 8MEG X 8-BIT (64M), USER-CONFIGURABLE, RADIATION HARDENED, MAGNETORESISTIVE RAM (MRAM), MULTICHIP MODULE (MCM)
active, Most Current
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| Organization: | DOD |
| Publication Date: | 5 November 2020 |
| Status: | active |
| Page Count: | 29 |
scope:
Scope.
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Document History
SMD 5962-13207
November 5, 2020
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, FOUR - 2MEG X 8-BIT or ONE - 8MEG X 8-BIT (64M), USER-CONFIGURABLE, RADIATION HARDENED, MAGNETORESISTIVE RAM (MRAM), MULTICHIP MODULE (MCM)
Scope.
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes...
August 23, 2019
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, FOUR - 2MEG X 8-BIT or ONE - 8MEG X 8-BIT (64M), USER-CONFIGURABLE, RADIATIONHARDENED, MAGNETORESISTIVE RAM (MRAM), MULTICHIP MODULE (MCM)
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are...
July 25, 2017
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, FOUR - 2MEG X 8-BIT or ONE - 8MEG X 8-BIT (64M), USERCONFIGURABLE, RADIATION-HARDENED, MAGNETORESISTIVE RAM (MRAM), MULTICHIP MODULE (MCM)
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are...
January 11, 2016
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, FOUR - 2MEG X 8-BIT or ONE - 8MEG X 8-BIT (64M), USERCONFIGURABLE, RADIATION-HARDENED, MAGNETORESISTIVE RAM (MRAM), MULTICHIP MODULE (MCM)
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are...
November 24, 2014
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, FOUR - 2MEG X 8-BIT or ONE - 8MEG X 8-BIT (64M), USERCONFIGURABLE, RADIATION-HARDENED, MAGNETORESISTIVE RAM (MRAM), MULTICHIP MODULE (MCM)
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are...