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JEDEC - JESD305

DDR5 Load Reduced (LRDIMM) and Registered Dual Inline Memory Module (RDIMM) Common Specification

active
Organization: JEDEC
Publication Date: 1 January 2022
Status: active
Page Count: 46

Document History

JESD305-R4-RCB
April 1, 2022
DDR5 RDIMM Standard Annex B
This standard, JESD305-R4-RCB, DDR5 Registered Dual Inline Memory Module with 4-bit ECC (EC4 RDIMM) Raw Card B Annex, defines the design detail of x4, 2 Package Ranks DDR5 RDIMM with 4-bit ECC. The...
JESD305-R8-RCD
April 1, 2022
DDR5 RDIMM Standard Annex D
This standard, JESD305-R8-RCD, DDR5 Registered Dual Inline Memory Module with 8-bit ECC (EC8 RDIMM) Raw Card D Annex, defines the design detail of x8, 1 Package Rank DDR5 RDIMM with 8-bit ECC. The...
JESD305
January 1, 2022
DDR5 Load Reduced (LRDIMM) and Registered Dual Inline Memory Module (RDIMM) Common Specification
A description is not available for this item.

References

This document references:
JEDEC JESD 300-5 - SPD5118, SPD5108 Hub and Serial Presence Detect Device Standard
Published by JEDEC on February 1, 2020
This standard defines the specifications of interface parameters, signaling protocols, and features for DDR5 Serial Presence Detect EEPROM with Hub function (SPD5 Hub) and integrated Temperature...
This document references:
JESD302-1A - TS511X, TS521X Serial Bus Thermal Sensor Device Standard
Published by JEDEC on August 1, 2023
This standard defines the specifications of interface parameters, signaling protocols, and features for fifth generation Temperature Sensor (TS5) as used for memory module applications. These device...
This document references:
JESD403-1C - JEDEC Module Sideband Bus (SidebandBus)
Published by JEDEC on December 1, 2023
This standard defines the assumptions for the system management bus for next generation memory solutions; covering the interface protocol, use of hub devices, and voltages appropriate to these usages.
This document references:
JESD79-5B - DDR5 SDRAM
Published by JEDEC on September 1, 2022
This standard defines the DDR5 SDRAM specification, including features, functionalities, AC and DC characteristics, packages, and ball/signal assignments. The purpose of this Standard is to define...
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