BSI - BS IEC 63068-4
Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence
active, Most Current
| Organization: | BSI |
| Publication Date: | 30 September 2022 |
| Status: | active |
| Page Count: | 28 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
BS IEC 63068-4
September 30, 2022
Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence
A description is not available for this item.