UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

ESD - SP5.3.4

Electrostatic Discharge Sensitivity Testing Charged Device Model (CDM) Testing Component Level Capacitively Coupled Transmission Line Pulsing (CC-TLP) as an Alternative CDM Characterization Method

active, Most Current
Organization: ESD
Publication Date: 18 January 2022
Status: active
Page Count: 24
scope:

This document establishes a procedure for testing components and microcircuits, such as integrated circuits, discrete semiconductor components, and electronic modules containing more than a single component, according to its susceptibility (sensitivity) to damage or degradation by exposure to a defined contact CDM like electrostatic discharge (ESD). This contact-based test method can be performed on packaged devices as well as on bare dies and wafers.

Purpose

The purpose of this document is to define a contact-based test method for a reliable, repeatable charged device model (CDM) characterization.

Document History

SP5.3.4
January 18, 2022
Electrostatic Discharge Sensitivity Testing Charged Device Model (CDM) Testing Component Level Capacitively Coupled Transmission Line Pulsing (CC-TLP) as an Alternative CDM Characterization Method
This document establishes a procedure for testing components and microcircuits, such as integrated circuits, discrete semiconductor components, and electronic modules containing more than a single...

References

Advertisement