CEI - EN IEC 60749-10
Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly
active, Most Current
| Organization: | CEI |
| Publication Date: | 1 December 2022 |
| Status: | active |
| Page Count: | 20 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.
Document History
EN IEC 60749-10
December 1, 2022
Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility...
March 1, 2004
Semiconductor devices - Mechanical and climatic test method - Part 10: Mechanical shock
La presente Norma internazionale fa parte della serie IEC 60749 e descrive un metodo di prova relativo agli urti meccanici.
La prova ha lo scopo di determinare l'idoneità delle parti componenti usate...