scope:

This test method provides a means to assess the propensity for conductive anodic filament (CAF) growth and other forms of electrochemical migration failure modes within a printed board (PB). This test method can be used to assess PB laminate materials, PB design and application parameters, PB manufacturing process changes and other applications such as press-fit connectors.

Warning 1: This IPC test method has not been designed for use with voltages exceeding 100 Vdc bias, however higher voltage bias testing is being routinely required to be performed, such as for electric vehicle electronics. Note that at 100 Vdc using 20 mA cut-off means 2 watts of power being dissipated per channel, so using a much lower cut-off current is recommended for better root cause failure analysis.

Warning 2: As voltage bias is increased, the wiring insulation required needs to change in order to ensure operator safety.