scope:

This test method provides a means to assess the propensity for conductive anodic filament (CAF) growth, a form of electrochemical migration, and similar conductive filament formation (CFF) laminate material failure modes within a printed wiring board (PWB). Conductive anodic filaments may be composed of conductive salts, rather than cationic metal ions, however inadequate dielectric for the applied voltage, component failures, and part use exceeding the maximum operating temperature (MOT) of the laminate can contribute to product failures as well. This test method can be used to assess PWB laminate materials, PWB design and application parameters, PWB manufacturing process changes and press-fit connector applications.