Semiconductor devices – Micro-electromechanical devices – Part 9: Wafer to wafer bonding strength measurement for MEMS
|Publication Date:||1 July 2011|
|ICS Code (Other semiconductor devices):||31.080.99|
This standard describes bonding strength measurement method of
wafer to wafer bonding, type of bonding process such as silicon to
silicon fusion bonding, silicon to glass anodic bonding, etc., and
applicable structure size during MEMS processing/assembly.