scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-PRF-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the Following example:

Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access time 01 WS-128K32-120Q SRAM, 128K × 32-BIT 120 ns 02 WS-128K32-100Q SRAM, 128K × 32-BIT 100 ns 03 WS-128K32-85Q SRAM, 128K × 32-BIT 85 ns 04 WS-128K32-70Q SRAM, 128K × 32-BIT 70 ns 05 WS-128K32-55Q,ACT-S128K32N-055Q SRAM, 128K × 32-BIT 55 ns 06 WS-128K32-45Q,ACT-S128K32N-045Q SRAM, 128K × 32-BIT 45 ns 07 WS-128K32-35Q,ACT-S12BK32N-035Q SRAM, 128K × 32-BIT 35 ns 08 WS-128K32-25Q,ACT-S128K32N-025Q SRAM, 128K × 32-BIT 25 ns 09 WS-128K32-20Q,ACT-S128K32N-020Q SRAM, 128K × 32-BIT 20 ns 10 WS-128K32-17Q,ACT-S128K32N-017Q SRAM, 128K × 32-BIT 17 ns

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation H or K Certification and qualification to MIL-PRF-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style M See figure 1 68 Ceramic, Quad Flatpack, dual cavity X See figure 1 68 Ceramic, Quad Flatpack Y See figure 1 68 Ceramic, Quad Flatpack, Low profile Z See figure 1 68 Ceramic, Quad Flatpack, dual cavity

The lead finish shall be as specified in MIL-PRF-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or ft packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) ........................... −0.5 V dc to +7.0 V dc Signal voltage range (any pin) ....................... −0.5 V dc to +7.0 V dc Power dissipation (P_D): Device types 01 through 08 ......................... 2.75W max Device types 09 and 10 ............................. 3.30W max Thermal resistance junction-to-case (θ_JC): Case outlines X and Y .............................. 6.6°C/W Case outline M .................................... 10°C/W Case outline Z ..................................... 8°C/W Storage temperature .................................. −65°C to +150°C Lead temperature (soldering, 10 seconds) ............. +300°C

Supply voltage (V_CC) ................................. +4.5 V dc to +5.5 V dc Input low voltage range (V_IL) ........................ −0.3 V dc to +0.8 V dc Input high voltage range (V_IH) ....................... +2.2 V dc to V_CC +0.5 V dc Output low voltage, maximum (V_OL) .................... +0.4 V dc Output high voltage, minimum (V_OH).................... +2.4 V dc Case operating temperature range (T_C) ................ −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.