DLA - SMD-5962-95595
MICROCIRCUIT, HYBRID, MEMORY, DIGITAL, STATIC RANDOM ACCESS MEMORY, CMOS, 128K X 32-BIT
| Organization: | DLA |
| Publication Date: | 19 July 1995 |
| Status: | inactive |
| Page Count: | 25 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function Access time 01 WS-128K32-120G4Q SRAM, 128K × 32-BIT 120 ns 02 WS-128K32-100G4Q SRAM, 128K × 32-BIT 100 ns 03 WS-128K32-85G4Q SRAM, 128K × 32-BIT 85 ns 04 WS-128K32-70G4Q SRAM, 128K × 32-BIT 70 ns 05 WS-128K32-55G4Q SRAM, 128K × 32-BIT 55 ns 06 WS-128K32-45G4Q SRAM, 128K × 32-BIT 45 ns 07 WS-128K32-35G4Q SRAM, 128K × 32-BIT 35 ns 08 WS-128K32-25G4Q SRAM, 128K × 32-BIT 25 ns 09 WS-128K32-20G4Q SRAM, 128K × 32-BIT 20 ns 10 WS-128K32-17G4Q SRAM, 128K × 32-BIT 17 ns
This device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation H or K Certification and qualification to MIL-H-38534
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X See figure 1 68 Ceramic, Quad Flatpack Y See figure 1 68 Ceramic, Qual Flatpack, Low profile
The lead finish shall be as specified in MIL-H-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (VCC) . . . . . . . . . . −0.5 V dc to +7.0 V dc Signal voltage range (any pin) . . . . . . . . . −0.5 V dc to +7.0 V dc Power dissipation (PD): Device types 01 through 08 . . . . . . . . . . 2.2W Device types 09 and 10 . . . . . . . . . . . . 4.4W Thermal resistance junction-to-case (θJC) . . . 6.6°C/W Storage temperature . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . +300°C
Supply voltage (VCC) . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Input low voltage range (VIL) . . . . . . . . . −0.5 V dc to +0.8 V dc Input high voltage range (VIH) . . . . . . . ...... +2.2 V dc to VCC +0.3 V dc Output low voltage, maximum (VOL) . . . . . . . +0.4 V dc Output high voltage, minimum (VOH) . . . . . . +2.4 V dc Case operating temperature range (TC) . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Document History
