Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 1: Erosion test method for metal materials without surface processing
|Publication Date:||1 June 2013|
|ICS Code (Electronic component assemblies):||31.190|
|ICS Code (Mechanical structures for electronic equipment):||31.240|
This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.