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IEC 62739-1

Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 1: Erosion test method for metal materials without surface processing

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Organization: IEC
Publication Date: 1 June 2013
Status: active
Page Count: 40
ICS Code (Electronic component assemblies): 31.190
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

Document History

IEC 62739-1
June 1, 2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 1: Erosion test method for metal materials without surface processing
This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as...

References

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