Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 2: Erosion test method for metal materials with surface processing
|Publication Date:||1 July 2016|
|ICS Code (Electronic component assemblies):||31.190|
|ICS Code (Mechanical structures for electronic equipment):||31.240|
This part of IEC 62739 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle.