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IEC 62739-2

Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 2: Erosion test method for metal materials with surface processing

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Organization: IEC
Publication Date: 1 July 2016
Status: active
Page Count: 36
ICS Code (Electronic component assemblies): 31.190
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This part of IEC 62739 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle.

Document History

IEC 62739-2
July 1, 2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 2: Erosion test method for metal materials with surface processing
This part of IEC 62739 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath...

References

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