Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 3: Selection guidance of erosion test methods
|Publication Date:||1 January 2017|
|ICS Code (Electronic component assemblies):||31.190|
|ICS Code (Mechanical structures for electronic equipment):||31.240|
This part of IEC 62739 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.