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DLA - DSCC-VID-V62/13628

MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICRCONTROLLER, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 7 April 2014
Status: inactive
Page Count: 36
scope:

This drawing documents the general requirements of a high performance mixed signal microcontroller microcircuit, with an operating temperature range of -40°C to +105°C.

Document History

DSCC-VID-V62/13628 REV A
April 29, 2019
MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICRCONTROLLER, MONOLITHIC SILICON
Scope. This drawing documents the general requirements of a high performance mixed signal microcontroller microcircuit, with an operating temperature range of -40°C to +105°C.
DSCC-VID-V62/13628
April 7, 2014
MICROCIRCUIT, DIGITAL, MIXED SIGNAL MICRCONTROLLER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance mixed signal microcontroller microcircuit, with an operating temperature range of -40°C to +105°C.

References

This document references:
JEP95 BOOK 1 - Book One Registered and Standard Outlines for Solid State and Related Products
Published by JEDEC on March 1, 1997
PREFACE This Publication contains those solid state product outlines and other associated drawings that have been registered and assigned a JEDEC designation and are printed on white paper. Product...
This document references:
JEDEC JESD 51 - Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
Published by JEDEC on December 1, 1995
This standard and its subsequent addendum's, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of...
This document references:
JEDEC JESD 51-3 - Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on August 1, 1996
This standard describes design requirements for a single layer, leaded surface mount integrated circuit package thermal test board. The standard describes board material and geometry requirements,...
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
This document references:
J-STD-020F - Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Published by JEDEC on December 1, 2022
This classification procedure applies to all non-hermetic SMDs, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means...
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