scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 DS90C031 LVDS quad cmos differential line driver

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage (V_CC).......................................−0.3 V to +6 V Input voltage (V_IN)........................................−0.3 V to (V_CC + 0.3 V) Enable input voltage (EN, EN*).............................−0.3 V to (V_CC + 0.3 V Output voltage (D_OUT+, D_OUT−)..............................−0.3 V to (V_CC + 0.3 V) Storage temperature range..................................−65°C to +150°C Maximum power dissipation (P_D): Case F...................................................1450 mW 2/ Case 2...................................................1900 mW 2/ Lead temperature (soldering, 10 seconds)................. +260°C Junction temperature (T_J)..................................+150°C Thermal resistance, junction-to-case (Θ_JC): Case F...................................................12°C/W Case 2...................................................18°C/W Thermal resistance, junction-to-ambient (Θ_JA): Case F...................................................103°C/W Case 2...................................................78°C/W

Supply voltage (V_CC).......................................4.5 V to 5.5 V Ambient operating temperature range (T_A)...................−55°C to +125°C

intended Use: