scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked device meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 DS90C031 LVDS quad cmos differential line driver

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style F GDFP2-F16 or CDFP3-R16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535, for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage (V_CC).........................................−0.3 V to +6V Input voltage (V_IN)..........................................−0.3 V to (V_CC + 0.3 V) Enable input voltage (EN, EN*)...............................−0.3 V to (V_CC + 0.3 V Output voltage (D_OUT+, D_OUT−)................................−0.3 V to (V_CC + 0.3 V) Storage temperature range....................................−65°C to 150°C Maximum power dissipation (P_D): Case F.....................................................1450 mW Case 2.....................................................1900 mW Lead temperature (soldering, 10 seconds).....................+260°C Junction temperature (T_J)....................................+150°C Thermal resistance, junction-to-case (Θ_JC): Case F.....................................................12°C/W Case 2.....................................................18°C/W Thermal resistance, junction-to-ambient(Θ_JA): Case F.....................................................103°C/W Case 2.....................................................78°C/W

Supply voltage (V_CC).........................................4.5 V to 5.5 V Ambient operating temperature range (T_A).....................−55°C to +125°C

The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.

SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-973 - Configuration Management. MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.

HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's). MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.

intended Use: