DOD - SMD 5962-96605
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, HEX D-TYPE FLIP-FLOP, MONOLITHIC SILICON
inactive
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| Organization: | DOD |
| Publication Date: | 18 August 1997 |
| Status: | inactive |
| Page Count: | 27 |
Document History
June 3, 2019
MICROCIRCUIT, DIGITAL, CMOS, RADIATION HARDENED, HEX D-TYPE FLIP-FLOP, MONOLITHIC SILICON
Scope.
This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes...
June 16, 2010
MICROCIRCUIT, DIGITAL, CMOS, RADIATION HARDENED, HEX D-TYPE FLIP-FLOP, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
November 18, 2003
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, HEX D-TYPE FLIP-FLOP, MONOLITHIC SILICON
A description is not available for this item.
SMD 5962-96605
August 18, 1997
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, HEX D-TYPE FLIP-FLOP, MONOLITHIC SILICON
A description is not available for this item.
February 28, 1997
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, HEX D-TYPE FLIP-FLOP, MONOLITHIC SILICON
This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535...
December 5, 1995
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, CMOS, HEX D-TYPE FLIP-FLOP, MONOLITHIC SILICON
A description is not available for this item.