scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q, and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54ACT8997 Scan path linkers with 4-bit identification buses

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CDIP3-T28 or GDIP4-T28 28 Dual-in-line package 3 CQCC1-N28 28 Square chip carrier package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC)- - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range (V_IN) - - - - - - - - - - - - - - - - −0.5 V dc to V_CC +0.5 V dc Output voltage range (V_OUT) - - - - - - - - - - - - - - - −0.5V dc to V_CC +0.5 V dc Continuous output current (I_OUT)- - - - - - - - - - - - - ±25 mA Input clamp current (I_IK) - - - - - - - - - - - - - - - - ±20 mA Output clamp current (I_OK)- - - - - - - - - - - - - - - - ±20 mA Storage temperature range - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - +300°C Junction temperature (T_J) - - - - - - - - - - - - - - - - +175°C Maximum power dissipation (P_D): 2/- - - - - - - - - - - - 193 mW Thermal resistance, junction-to-case (Θ_JC) - - - - - - - See MIL-STD-1835

Supply voltage range (V_CC)- - - - - - - - - - - - - - - - 4.5 V dc to +5.5 V dc Input voltage range (V_IN) - - - - - - - - - - - - - - - - 0 to V_CC Output voltage range (V_OUT) - - - - - - - - - - - - - - - 0.to V_CC High level input voltage (V_IH)- - - - - - - - - - - - - - 2 V minimum Low level input voltage (V_IL) - - - - - - - - - - - - - - 0.8 V maximum High level output current (I_OH): TDO, DTD01-4, MCO - - - - - - - - - - - - - −8.5 mW DTMS1-4, DCO (3-state), DTCK - - - - - - - −13.6 mA Low level output current (I_OL): TDO, DTD01-4, MCO - - - - - - - - - - - - - 8.5 mA DCO, (open drain or 3-state) - - - - - - - 13.6 mA DTMS1-4 - - - - - - - - - - - - - - - - - - 20.4 mA DTCK - - - - - - - - - - - - - - - - - - - 40.8 mA Ambient operating temperature range (T_A) - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - - - - - 3/ percent

intended Use: