scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Detect time Correct time 01 49C460A 32-bit EDCU 33 ns 39 ns 02 49C460B 32-bit EDCU 28 ns 33 ns 03 29C660A 32-bit EDCU 33 ns 39 ns 04 29C660B 32-bit EDCU 28 ns 33 ns 05 29C660C 32-bit EDCU 21 ns 29 ns 06 49C460C 32-bit EDCU 21 ns 29 ns 07 49C460D 32-bit EDCU 16 ns 22 ns

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style U CMGA3-68 68 pin grid array X See figure 1 68 dual-in-line package Y CQCC1-N84 68 square chip carrier Z See figure 2 68 square chip carrier T See figure 3 68 quad flat package

Voltage on any pin relative to ground ................. −0.5 V dc to +7.0 V dc 2/ DC output current into outputs ........................ 30 mA Storage temperature range ............................. −65°c to +150°c Maximum power dissipation (P_D) ........................ 1.0 W 3/ 4/ Lead temperature (soldering, 10 seconds) .............. +300°C Thermal resistance, junction-to-case (O_JC): Cases U and Y ....................................... See MIL-STD-1835 Case X .............................................. 38°C/W 5/ Case Z .............................................. 35°C/W 5/ Case T .............................................. 20°C/W Junction temperature (T_J) ............................. +150°C

Supply voltage range (V_CC) ...................... 4.5 V dc to 5.5 V dc Minimum input high voltage (V_IH) ................ 2.0 V dc Maximum input low voltage (V_IL) ................. 0.8 V dc Case operating temperature range (T_C) ........... −55°C to +125°C

intended Use: