scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 DS1776 Octal Pi-bus transceiver

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-1-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 dual-in-line 3 CQCCl-N28 or COCC2-N28 28 square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc V_X, V_OH output level control voltage (A outputs) - - - - −0.5 V dc to +7.0 V dc A0-A7, B0-B7 input voltage V_I - - - - - - - - - - - - - −0.5 V dc to +5.5 V dc [O bar][E bar][B bar]n, OEA, [L bar][E bar] input voltage (V_I) - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input current (I_I) - - - - - - - - - - - - - - - - - - - −40 mA to +5 mA Voltage applied to output in high voltage state (V_O) - - −0.5 V to +V_CC A0-A7 current applied to output in low output state (I_O) 40 mA B0-B7 current applied to output in low output state (I_O) 200 mA Storage temperature range (T_STG) - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D): Case outline X - - - - - - - - - - - - - - - - - - - - 1000 mW Case outline 3 - - - - - - - - - - - - - - - - - - - - 740 mW Lead temperature (soldering, 10 seconds) - - - - - - - - +260°C Thermal resistance, junction-to-case (Θ_JC) - - - - - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - - - - - - +175°C Thermal resistance, junction-to-ambient (Θ_JA): Case outline X - - - - - - - - - - - - - - - - - - - - +50.4°C/W Case outline 3 - - - - - - - - - - - - - - - - - - - - +67.5°C/W Case operating temperature (T_C) - - - - - - - - - - - −55°C to +125°C

Supply voltage range (V_CC) - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Maximum high level input voltage (V_IH): 3/ B₀ - B₇ - - - - - - - - - - - - - - - - - - - - - - - 1.60 V All others - - - - - - - - - - - - - - - - - - - - - - - 2.0 V Maximum low level input voltage (V_IL): 3/ B₀ - B₇ - - - - - - - - - - - - - - - - - - - - - - - 1.45 V All others - - - - - - - - - - - - - - - - - - - - - - 0.8 V Maximum input clamp current (I_IK): A₀ - A₇ - - - - - - - - - - - - - - - - - - - - - - - −40 mA All others - - - - - - - - - - - - - - - - - - - - - - −18 mA Maximum high level output current (I_OH): A₀ - A₇ - - - - - - - - - - - - - - - - - - - - - - - 100 µA Maximum low level output current (I_OL): A₀ - A₇ - - - - - - - - - - - - - - - - - - - - - - - 20 mA B₀ - B₇ - - - - - - - - - - - - - - - - - - - - - - - 100 mA Case operating temperature range (T_C) - - - - - - - - - −55°C to +125°C Minimum setup time, A to [L bar][E bar] (t_s H), (t_s L) - - - - - - - 7 ns Minimum hold time, A to [L bar][E bar] (t_h H), (t_h L) - - - - - - - 0.0 ns Minimum LE pulse width low (t_w L) - - - - - - - - - - - 12 ns

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - XX percent 4/

intended Use: