DLA - SMD-5962-92317 REV C
MICROCIRCUIT, DIGITAL, CMOS, OCTAL PI-BUS TRANSCEIVER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 3 March 1995 |
| Status: | inactive |
| Page Count: | 28 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify tthe circuit function as follows:
Device type Generic number Circuit function 01 AD7876TQ 12-bit A/D converter with track/hold
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 dual-in-line
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
VDD to AGND . . . . . . . . . . . . . . . . . . . −0.3 V dc to +7.0 V dc VSS to AGND . . . . . . . . . . . . . . . . . . . +0.3 V dc to −7.0 V dc AGND to DGND . . . . . . . . . . . . . . . . . . −0.3 V dc to VDD + 0.3 V dc VIN to AGND . . . . . . . . . . . . . . . . . . . −15 V dc to +15 V dc REFOUT to AGND . . . . . . . . . . . . . . . . . 0 V dc to VDD Digital inputs to DGND. . . . . . . . . . . . . . −0.3 V dc to VDD + 0.3 V dc Digital Outputs to DGND . . . . . . . . . . . . . −0.3 V dc to VDD + 0.3 V dc Power dissipation at TA = +75°C (PD.) 2/ . . . . 450 mW Lead temperature (soldering, 10 seconds) . . . . +300°C Storage temperature range . . . . . . . . . . . . −65°C to +150°C Thermal resistance, junction-to-case (θJC) . . . See MIL-STD-1835
Positive supply voltage (VDD) . . . . . . . . . . +4.75 v dc to +5.25 V dc Negative supply voltage (VSS) . . . . . . . . . . −4.75 V dc to −5.25 V dc AGND . . . . . . . . . . . . . . . . . . . . . . 0 V dc DGND . . . . . . . . . . . . . . . . . . . . . . 0 V dc External clock frequency (fCLK) . . . . . . . . . 2.5 MHz Ambient operating temperature range (TA) . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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