BSI - BS EN 62047-2
Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials
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| Organization: | BSI |
| Publication Date: | 30 November 2006 |
| Status: | active |
| Page Count: | 16 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
BS EN 62047-2
November 30, 2006
Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials
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