UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

BSI - BS EN 62047-8

Semiconductor devices - Micro-electromechanical devices Part 8: Strip bending test method for tensile property measurement of thin films

active, Most Current
Buy Now
Organization: BSI
Publication Date: 30 June 2011
Status: active
Page Count: 22
ICS Code (Other semiconductor devices): 31.080.99

Document History

BS EN 62047-8
June 30, 2011
Semiconductor devices - Micro-electromechanical devices Part 8: Strip bending test method for tensile property measurement of thin films
A description is not available for this item.

References

This document references:
IEC 62047-3 - Semiconductor devices – Micro-electromechanical devices – Part 3: Thin film standard test piece for tensile testing
Published by IEC on August 1, 2006
This International Standard specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm...
This document references:
BS EN 62047-2 - Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials
Published by BSI on November 30, 2006
A description is not available for this item.
This document references:
BS EN 62047-3 - Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
Published by BSI on November 30, 2006
A description is not available for this item.
This document references:
IEC 62047-2 - Semiconductor devices – Micro-electromechanical devices – Part 2: Tensile testing method of thin film materials
Published by IEC on August 1, 2006
This International Standard specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 μm, which are main structural materials for...
This document references:
EN 62047-2 - Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials
Published by CENELEC on September 1, 2006
A description is not available for this item.
This document references:
EN 62047-3 - Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
Published by CENELEC on September 1, 2006
This International Standard specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm...
This document is referenced by:
BS EN 62047-10 - Semiconductor devices - Micro-electromechanical devices Part 10: Micro-pillar compression test for MEMS materials
Published by BSI on September 30, 2011
A description is not available for this item.
View Less
View All

Related Products

Searching for related products...

Advertisement