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IPC-7530

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)

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Organization: IPC
Publication Date: 1 May 2001
Status: inactive
Page Count: 24
scope:

This guideline document addresses the issues pertinent to temperature profiling of electronic assemblies for mass soldering processes (reflow and wave).

 

Document History

March 1, 2017
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
This standard describes thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow...
IPC-7530
May 1, 2001
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
This guideline document addresses the issues pertinent to temperature profiling of electronic assemblies for mass soldering processes (reflow and wave).  

References

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