scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 34020-28 Graphics system processor 02 34020-30 Graphics system processor

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline X P-AG (145-pin, 1.580" × 1.580" × .345") pin grid array package Y C-U3 (132-pin, .960" × .960" × .130") leaded chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Maximum supply voltage (V_CC) 2/ - - - - - - - - - - - - 7.0 V dc Input voltage range - - - - - - - - - - - - - - - - - - −0.3V dc to 7.0 V dc Off-state output voltage range - - - - - - - - - - - - - −2.0 V dc to 7.0 V dc Operating temperature range - - - - - - - - - - - - - - −55°C to +125°C Storage temperature range - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - +260°C Thermal resistance, junction-to-case (Θ_JC) - - - - - - - See MIL-M-38510, appendix C Junction temperature (T_J) - - - - - - - - - - - - - - - +175°C Power dissipation - - - - - - - - - - - - - - - - - - - 1.375 W

Supply voltage range (V_CC): Device 01 - - - - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Device 02 - - - - - - - - - - - - - - - - - - - - - 4.75 V dc to 5.25 V dc Supply voltage (V_SS) 3/ - - - - - - - - - - - - - - - - 0 V dc Maximum high level output current (I_OH) - - - - - - - - 400 µA Maximum low level output current (I_OL) - - - - - - - - - 2 mA Case operating temperature range (T_C) - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - XX percent 4/

intended Use: