scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 34020-28 Graphics system processor 02 34020-30 Graphics system processor 03 34020A-32 Graphics system processor

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA7-P145 145 Pin grid array Y CQCC1-F132 132 Leaded chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Maximum supply voltage (V_CC) 2/ - - - - - - - - - - - - 7.0 V dc Input voltage range - - - - - - - - - - - - - - - - - - −0.3 V dc to 7.0 V dc Off-state output voltage range - - - - - - - - - - - - −2.0 V dc to 7.0 V dc Operating temperature range - - - - - - - - - - - - - - −55°C to +125°C Storage temperature range - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - +260°C Thermal resistance, junction-to-case (Θ_JC) - - - - - - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - - - - - - - +175°C Power dissipation - - - - - - - - - - - - - - - - - - - 1.375 W

Supply voltage range (V_CC): Device 01 - - - - - - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Device 02, 03 - - - - - - - - - - - - - - - - - - - - 4.75 V dc to 5.25 V dc Supply voltage (V_SS) 3/ - - - - - - - - - - - - - - - - 0 V dc Maximum high level output current (I_OH) - - - - - - - - 400 µA Maximum low level output current (I_OL)- - - - - - - - - 2 mA Case operating temperature range (T_C) - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . XX percent 2/

intended Use: