scope:
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN is as shown in the following example:
Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 UT63M147 +5.0 V, dual channel bus transceiver (low idle)1/
02 UT63M149 +5.0 V, dual channel bus transceiver (high idle)1/
03 UT63M147E +5.0 V, dual channel bus transceiver (low idle)1/
04 UT63M145 +5.0 V, dual channel bus transceiver (low idle)1/
The device class designator is a single letter identifying the product assurance level as follows:
Device class Device requirements documentation
M Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Q or V Certification and qualification to MIL-PRF-38535
The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
X See figure 1 36 dual-in-line
Z See figure 1 24 flat pack
The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.
Idle high: TXIN, [T bar][X bar][I bar][N bar], [R bar][X bar][O bar][U bar][T bar], RXOUT are at logic 1.
Supply voltage range ......................................... −0.3 V dc to +7.0 V dc
Input voltage range (receiver) ............................... 10 VPP
Logic input voltage range .................................... −0.3 V dc to +5.5 V dc
Output current (transmitter) ................................. 1.0 A
Power dissipation: 100% duty cycle (per channel) 3/
device 01, 02 .............................................. 2.21 W
device 03, 04 .............................................. 3.6 W
Thermal impedance junction-to-case (ΘJC)
device 01, 02 .............................................. 4.5°C/W
device 03, 04 .............................................. 6.0°C/W
Maximum junction temperature (TJ)
device 01, 02 .............................................. +125°C
device 03, 04 .............................................. +175°C
Storage temperature range .................................... −65°C to +150°C
Receiver common mode input voltage range ..................... −5.0 V to +5.0 V
Supply voltage range (VCC)
device 01, 02 .............................................. +4.75 V dc to +5.25 V dc
device 03, 04 .............................................. +4.5 V dc to +5.5 V dc
Logic input voltage range .................................... 0.0 V dc to +5.0 V dc
Receiver differential voltage ................................ 8.0 Vpp
Receiver common mode voltage range ........................... ±4.0 V dc
Driver peak output current
device 01, 02 .............................................. 700 mA
device 03, 04 .............................................. 600 mA
Serial data rate
device 01, 02 .............................................. 0 to 1 MHz
device 03, 04 .............................................. 300 KHz to 1 MHz
Radiation features:
Total dose ................................................... 1 × 106 Rads (Si)
Single event phenomenon (SEP) effective
linear energy threshold, no upsets or latchup (see 4.4.4.5)... > 35 MeV/(mg/cm2)
Dose rate upset (20 ns pulse) ................................ 4/
Dose rate latchup ............................................ 4/
Dose rate survivability ...................................... 4/
Neutron irradiated ........................................... > 1 × 1014
Case operating temperature range (TC) ........................ −55°C to +125°C
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) ................ 100 percent 5/
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing.
Device class Q devices will replace device class M devices.
Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications and logistics purposes.
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