scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 80486DX-25 32 Bit High Integration Microprocessor 02 80486DX-33 32 Bit High Integration Microprocessor

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA9-P168 168 Ceramic, pin grid array Y See figure 1 196 Leaded chip carrier with unformed leads

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Supply voltage with respect to ground range . . . . . . . −0.5V dc to +6.5V dc Voltage on any pin with respect to ground range . . . . . −0.5V dc to +6.5V dc Maximum power dissipation (P_D) . . . . . . . . . . . . . 5 W Lead temperature (soldering, 10 seconds). . . . . . . . . 300°C Thermal resistance, junction-to-case (θ_JC): Case X . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Case Y . . . . . . . . . . . . . . . . . . . . . . . . 2.5°C/W Maximum junction temperature (T_J) . . . . . . . . . . . . 150°C

Case operating temperature range . . . . . . . . . . . . −55°C to +125°C Supply voltage, (V_CC) . . . . . . . . . . . . . . . . 4.75 V dc ≤V_CC ≤ 5.25 V dc

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . 2/ percent

intended Use: