DLA - SMD-5962-93105 REV B
MICROCIRCUIT, DIGITAL, CMOS, 32-BIT HIGH INTEGRATION MICROPROCESSOR, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 28 March 1996 |
| Status: | inactive |
| Page Count: | 32 |
scope:
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN is as shown in the following example:
Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function 01 80486DX-25 32 Bit High Integration Microprocessor 02 80486DX-33 32 Bit High Integration Microprocessor 03 1/ 80486DX2-50 32 Bit High Integration Microprocessor 04 1/ 80486DX2-66 32 Bit High Integration Microprocessor 05 1/ 80486DX-25 32 Bit High Integration Microprocessor 06 1/ 80486DX-33 32 Bit High Integration Microprocessor 07 1/ 80486DX2-50 32 Bit High Integration Microprocessor 08 1/ 80486DX2-66 32 Bit High Integration Microprocessor
The device class designator is a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and Qualification to MIL-PRF-38535
The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X CMGA9-P168 168 Ceramic, pin grid array Y See Figure 1 196 Leaded chip carrier with
The Lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.
Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Supply voltage with respect to ground range . . . . . . . −0.5V dc to +6.5V dc Voltage on any pin with respect to ground range . . . . . −0.5V dc to +6.5V dc Maximum power dissipation (PD) Device 01, 02, 05, 06 . . . . . . . . . . . . . . . . . 5 W Device 03, 04, 07, 08 . . . . . . . . . . . . . . . . 6.3 W Lead temperature (soldering, 10 seconds) . . . . . . . . 300°C Thermal resistance, junction-to-case (θJC): Case X . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Case Y . . . . . . . . . . . . . . . . . . . . . . . . 2.5°C/W Maximum junction temperature (TJ) . . . . . . . . . . . . 150°C
Case operating temperature range . . . . . . . . . . . . −55°C to +125°C Supply voltage, (VCC) . . . . . . . . . . . . . . . . . . 4.75 V dc ≤ VCC ≤ 5.25 V dc
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . 98.5 percent
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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