DLA - SMD-5962-93105 REV A
MICROCIRCUIT, DIGITAL, CMOS, 32-BIT HIGH INTEGRATION MICROPROCESSOR, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 23 March 1994 |
| Status: | inactive |
| Page Count: | 30 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 80486DX-25 32 Bit High Integration Microprocessor 02 80486DX-33 32 Bit High Integration Microprocessor 03 1/ 80486DX2-50 32 Bit High Integration Microprocessor 04 1/ 80486DX2-66 32 Bit High Integration Microprocessor
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X CMGA9-P168 168 Ceramic, pin grid array Y See Figure 1 196 Leaded chip carrier with unformed
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Supply voltage with respect to ground range . . . . . . . −0.5 V dc to +6.5 V dc Voltage on any pin with respect to ground range . . . . . −0.5 V dc to +6.5 V dc Maximum power dissipation (PD) Device 01, 02 . . . . . . . . . . . . . . . . . . . . 5 w Device 03, 04 . . . . . . . . . . . . . . . . . . . . 6.3 W Lead temperature (soldering, 10 seconds) . . . . . . . . 300°C Thermal resistance, junction-to-case (θJC): Case X . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Case Y . . . . . . . . . . . . . . . . . . . . . . . . 2.5°C/W Maximum junction temperature (TJ) . . . . . . . . . . . . 150°C
Case operating temperature range . . . . . . . . . . . . −55°C to +125°C Supply voltage, (VCC) . . . . . . . . . . . . . . . . . . 4.75 V dc ≤ VCC ≤ 5.25 V dc
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . 98.5 percent
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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