scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device classes M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number 1/ Circuit function t_PD Buffer type 01,05 22VP10 22-input 10 output 25 ns CMOS AND-OR-Logic array 02 22VP10 22-input 10 output 25 ns TTL AND-OR-Logic array 03,06 22VP10 22-input 10 output 20 ns CMOS AND-OR-Logic array 04 22VP10 22-input 10 output 20 ns TTL AND-OR-Logic array

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CDFP4-F24 24 Flat package L GDIP3-T24 or CDIP4-T24 24 Dual-in-line package Y CQCC2-F28A 24 Unformed lead chip carrier package

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range .................................. −0.3 V dc to +7.0 V dc Input voltage range ................................... −0.3 V dc to +7.0 V dc 3/ Output voltage applied ................................ −0.5 V dc to +7.0 V dc 3/ Output sink current ................................... 12 mA Thermal resistance, junction-to-case(θ_JC).............. See MIL-STD-1835 Maximum power dissipation (P_D) 4/ ..................... 1.6 W Maximum junction temperature .......................... +175°C Lead temperature (soldering, 10 seconds maximum) ...... +300°C Data retention ........................................ 10 years (minimum)

Supply voltage range (V_DD) ............................ 4.5 V dc to 5.5 V dc 5/ High level input voltage (V_IH) TTL .................... 2.2 V dc minimum Low level input voltage (V_IL) TTL ..................... 0.8 V dc maximum High level input voltage (V_IH) CMOS.................... 0.7 × V_DD Low level input voltage (V_IL) CMOS .................... 0.3 × V_DD Case operating temperature range (T_C).................. −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) .......... percent 6/

intended Use: