scope:

This drawing documents five product assurance classes, class D (lowest reliability), class E, (exceptions), class G (lowest high reliability), class H (high reliability), and class K, (highest reliability) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Access Time 01 WF128K32-150HQ5,ACT-F128K32N-150 FLASH EPROM, 128K × 32-bit 150 ns 02 WF128K32-120HQ5,ACT-F128K32N-120 FLASH EPROM, 128K × 32-bit 150 ns 03 WF128K32-90HQ5,ACT-F128K32N-90 FLASH EPROM, 128K × 32-bit 90 ns 04 WF128K32-70HQ5,ACT-F128532N-70 FLASH EPROM, 128K × 32-bit 70 ns 05 WF128K32-60HQ5 FLASH EPROM, 128K × 32-bit 60 ns

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device performance documentation D, E, G, H, or K Certification and qualification to MIL-PRF-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style M See figure 1 68 Ceramic, dual cavity, quad pack, lead formed N See figure 1 68 Ceramic, low profile, single cavity, quad pack, lead formed S See figure 1 66 Hex-in-line, single cavity, with standoffs T See figure 1 66 Hex-in-line, single cavity, without standoffs U See figure 1 66 Hex-in-line, single cavity, with standoffs V See figure 1 66 Hex-in-line, single cavity, without standoffs W See figure 1 66 Hex-in-line, single cavity, with standoffs X See figure 1 66 Hex-in-line, single cavity, without standoffs Y See figure 1 66 Hex-in-line, single cavity, with standoffs Z See figure 1 66 Hex-in-line, single cavity, without standoffs 4 See figure 1 68 Cermic, single cavity, quad flat pack 5 See figure 1 66 1.075", hex-in-line, single cavity, with standoffs 6 See figure 1 66 1.075", hex-in-line, single cavity, with standoffs 7 See figure 1 66 1.075", hex-in-line, single cavity, with standoffs 8 See figure 1 66 1.075", hex-in-line, single cavity, with standoffs

The lead finish shall be as specified in MIL-PRF-38534.

Supply voltage range (V_CC) 2/ ........................... −2.0 V dc to +7.0 V dc Signal Voltage range (any pin except A9) 2/ ............. −2.0 V dc to +7.0 V dc Power dissipation (P_D) .................................. 1.1 W Storage temperature range ............................... −65°C to +150°C Lead temperature (soldering, 10 seconds) ................ +300°C Data retention .......................................... 10 years minimum Endurance (write/erase cycles ............................ 10,000 cycles minimum A9 voltage for sector protect (V_ID) 3/ .................. −2.0 V dc to +14.0 V dc

Supply voltage range (V_CC) ............................... +4.5 V dc to +5.5 V dc Input low voltage range (V_IL) ............................ −0.5 V dc to +0.8 V dc Input high voltage range (V_IH) ........................... +2.0 V dc to V_CC + 0.3 V dc Case operating temperature range (T_C) .................... −55°C to +125°C A9 Voltage for sector protect (V_ID) ...................... +11.5 V dc to +12.5 V dc

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.