UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - J-STD-033

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

inactive
Buy Now
Organization: IPC
Publication Date: 1 October 2005
Status: inactive
Page Count: 28
scope:

Packages

Nonhermetic

This standard applies to all nonhermetic SMD packages subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other packages made with moisture-permeable polymeric materials (epoxies, silicones, etc.) that are exposed to the ambient air.

Hermetic

Hermetic SMD packages are not moisture sensitive and do not require moisture precautionary handling.

Document History

J-STD-033
April 1, 2018
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices and other moisture sensitive...
J-STD-033
August 1, 2014
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
A description is not available for this item.
J-STD-033
February 1, 2012
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture sensitive...
J-STD-033
October 1, 2005
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Packages Nonhermetic This standard applies to all nonhermetic SMD packages subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other...
J-STD-033
October 1, 2005
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Packages Nonhermetic    This standard applies to all nonhermetic SMD packages subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other...
J-STD-033
July 1, 2002
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Purpose The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMD packages which have...
JEDEC J-STD-033
April 1, 1999
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
A description is not available for this item.
View Less
View All

References

This document references:
ASTM F1249 - Standard Test Method for Water Vapor Transmission Rate Through Plastic Film and Sheeting Using a Modulated Infrared Sensor
Published by ASTM on June 1, 2020
This test method covers a procedure for determining the rate of water vapor transmission through flexible barrier materials. The method is applicable to sheets and films up to 3 mm (0.1 in.) in...
This document references:
F392/F392M - Standard Practice for Conditioning Flexible Barrier Materials for Flex Durability
October 1, 2023
This practice covers conditioning of flexible barrier materials for the determination of flex resistance. Subsequent testing can be performed to determine the effects of flexing on material...
This document references:
EIA-541 - Packaging Material Standards for ESD Sensitive Items
Published by ECIA on June 1, 1988
This standard applies to several different categories of electrostatic protective packaging materials. These packaging materials may possess certain electrostatic properties such as to prevent...
This document references:
IPC-7711/7721 - Rework, Modification and Repair of Electronic Assemblies Amendment 1
Published by IPC on July 1, 2020
A description is not available for this item.
This document references:
JEDEC JESD 22-A113 - Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
Published by JEDEC on April 1, 2020
This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs that is representative of a typical industry multiple solder reflow operation. These SMDs...
View Less
View All
Advertisement