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IPC - J-STD-033

Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

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Organization: IPC
Publication Date: 1 April 2018
Status: active
Page Count: 32
scope:

This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices and other moisture sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air.

Purpose

The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.

Document History

J-STD-033
April 1, 2018
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices and other moisture sensitive...
August 1, 2014
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
A description is not available for this item.
February 1, 2012
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture sensitive...
October 1, 2005
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Packages Nonhermetic    This standard applies to all nonhermetic SMD packages subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other...
October 1, 2005
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Packages Nonhermetic This standard applies to all nonhermetic SMD packages subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other...
July 1, 2002
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Purpose The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMD packages which have...
April 1, 1999
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
A description is not available for this item.

References

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