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ASTM International - ASTM F1709-97

Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications

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Organization: ASTM International
Publication Date: 1 January 1996
Status: inactive
Page Count: 3
ICS Code (Electronic display devices): 31.120
scope:

1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.

1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.

Document History

May 1, 2016
Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices. 1.2 This standard sets purity grade levels, physical...
June 15, 2008
Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
This specification covers high purity titanium sputtering targets for use as raw material in the fabrication of semiconductor electronic thin films. Material covered by this specification comprises...
December 10, 2002
Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices. 1.2 This standard sets purity grade levels, physical attributes,...
ASTM F1709-97
January 1, 1996
Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications
1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices. 1.2 This standard sets purity grade levels, physical attributes,...
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