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NPFC - MIL-C-47009

COMPOUND, SILICONE, HEAT SINK

inactive
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Organization: NPFC
Publication Date: 5 November 1982
Status: inactive
Page Count: 7

Document History

Compound, Silicone, Heat Sink
A description is not available for this item.
March 22, 2017
Compound, Silicone, Heat Sink
A description is not available for this item.
April 4, 2012
Compound, Silicone, Heat Sink
This specification covers four types of one-part ready-to-use silicone heat sink compound.
November 9, 2006
COMPOUND, SILICONE, HEAT SINK
This specification covers four types of one-part ready-to-use silicone heat sink compound.
January 21, 2000
COMPOUND, SILICONE, HEAT SINK
The material covered by this specification is intended for use in applications requiring heat transfer from circuit devices to substrates (heat sinks, chassis, and related items) where efficient...
June 30, 1989
COMPOUND, SILICONE, HEAT SINK
This specification covers the requirements for four types of one-part, ready to use, silicone heat sink compound, differing only in the physical properties shown in table I. TABLE I. Physical...
MIL-C-47009
November 5, 1982
COMPOUND, SILICONE, HEAT SINK
A description is not available for this item.
July 18, 1975
COMPOUND, SILICONE, HEAT SINK
A description is not available for this item.
April 19, 1974
COMPOUND, SILICONE, HEAT SINK
A description is not available for this item.

References

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