The material covered by this specification is intended for use in applications requiring heat transfer from circuit devices to substrates (heat sinks, chassis, and related items) where efficient cooling is required. All types have the same specific gravity, penetration-consistency, dielectric strength and volume resistivity. The types differ in bleed, evaporation and thermal conductivity.

Some of the applications for which the heat sink compound is intended require it to be used in military unique environments of extreme temperature ranges and shock and vibration levels.